關鍵詞 |
漢高ABLESTIKJM7000導電膠 |
面向地區 |
ABLESTIK JM7000具有高可靠性，低空洞特點，耐高溫可達370度。
常用超大規模集成電路封裝，陶瓷焊接封裝和焊接密封封裝
樂泰EA 3335透明UV耐熱耐水耐腐蝕光通訊光路膠
粘度 5000-7000cp 固化條件 UV 硬度80shoreA Tg值 135℃ CTE,低于Tg溫度59ppm/℃ CTE,Tg值溫度 ppm/℃
透明，UV快速固化，良好的耐熱，耐水，耐化學腐蝕性，低揮發。
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of Thermal Expansion, :
Below Tg, ppm/°C 33
Glass Transition Temperature (Tg) by TMA, °C 240
Bulk Thermal Conductivity, W/(m-K):
@ 90°C 1.1
@ 165°C 1.0
Tensile Modulus, DMTA :
Cured 30 minutes @ 300oC N/mm2 10,000
(psi) (1,450,377)
Extractable Ionic Content, @ 100°C:
Chloride (Cl-) <10
Sodium (Na+) <15
Potassium (K+) <15
Decomposition (in N2):
TGA analysis @ 10oC/ minute ramp from 25 to 400
oC
@ 340oC, % 0.2
@ 400oC, % 0.3
Electrical Properties
Sample cured 30 minutes @ 300oC
Volume Resistivity, ohm-cm ≤0.01
廣州本地漢高ABLESTIKJM7000導電膠熱銷信息
